As data transmission systems evolve toward higher speed and lower power, fiber-to-chip optical interconnects have become essential in advanced photonics. FEMTOPRINT enables this transition through custom glass microdevices that combine fiber ferrules, 3D waveguides, and micro-optical elements—all integrated in a single component.
Our glass micro-components allow for:
These microcomponents are ideal for applications such as optical transceivers, PICs, quantum devices, and sensor systems, where space constraints, performance, and alignment precision are critical. With the ability to fabricate wafer-scale batches, we provide a highly scalable path from prototyping to mass production.
