FEMTOprint has developed proprietary laser welding technology specifically designed to accelerate the development and manufacturing of innovative medical devices and disruptive healthcare solutions.
This advanced process enables high-precision, adhesive-free bonding of glass-to-glass and glass-to-metal interfaces, ensuring hermetic sealing, biocompatibility, and structural integrity even at the microscale.
Ideal for lab-on-a-chip systems, implantable devices, and miniaturized diagnostics, this technique eliminates thermal stress and contamination risks common in traditional bonding methods.
FEMTOprint’s solution empowers engineers and designers to unlock new frontiers in MedTech innovation, combining ultrafast laser processing with the reliability required for regulated medical applications.
Medical implants
Electronic packaging
Neuromodulation devices
Ophthalmic devices
Bio-sensors
Pressure sensors
Solid experience in laser encapsulation’s processes in several application domains.
Monolithic integration of optical, photonic, mechanical and fluidic functionalities in glass packaging.
Proven hermeticity for liquids and gases.
Glass-to-glass / glass-to-silicon sealing process at room temperature. This helps to preserve the functionalities of encapsulated electronics and micro-electronics devices.
Adhesive-free, biocompatible, working even at sub-mm size encapsulation.
