FEMTOprint have developed unique laser welding capabilities that can serve the development and fabrication of innovative and disruptive healthcare products.
Medical implants
Electronic packaging
Neuromodulation devices
Ophthalmic devices
Bio-sensors
Pressure sensors
Solid experience in laser encapsulation’s processes in several application domains.
Monolithic integration of optical, photonic, mechanical and fluidic functionalities in glass packaging.
Proven hermeticity for liquids and gases.
Glass-to-glass / glass-to-silicon sealing process at room temperature. This helps to preserve the functionalities of encapsulated electronics and micro-electronics devices.
Adhesive-free, biocompatible, working even at sub-mm size encapsulation.
