In datacom and telecom applications there is a clear trend to move towards 2D fiber arrays. These allow the integration of several channels per surface unit, in turn increasing the level of miniaturization.
The fabrication of glass ferrules with high precision 2D hole arrays still faces important technological challenges. Laser-based micro-machining represents a very promising solution, which can effectively handle dimensions in the range of few microns to a few millimeters with resolution and accuracy below 1 µm.
Micron to sub-micron control on hole diameter, possibly down to 500nm.
Micron to sub-micron control on hole position, possibly down to 500nm.
Sub-degree control on hole cylindricity, possibly << 0.1°.
Minimum hole diameter = 5um.
Surface roughness inside the hole better than 100nm.
Best tolerances for ferrules with thicknesses up to 10mm.
Materials: fused silica and borofloat 33.
