Our Ion Traps are not just simple components. They are fully functional devices enabling breakthrough progresses in the quantum realm. With unparalleled precision, we are able to engineer our Ion Traps with 3D metallic contacts for seamless electrical connectivity. This is where data flows unhindered, and possibilities become boundless.
Expertise on trench design for optimized insulation.
Deposition of metal films (Ti, Cr, Pt, Au) by sputtering or e-beam evaporation also at different angles.
Realization of masks.
Metallization of Through Glass Vias (TGVs).
Laser ablation of thin films for electrode insulation.
