The miniaturization of photonic integrated systems requires new monolithically integrated components and micro-fabrication technologies able to guarantee high resolution. This is also now required to enable a wide and cost-effective deployment, while increasing the number of functionalities.
The FEMTOPRINT® manufacturing platform allows writing 3D waveguides within the bulk of the glass. It can be used as photonic wire connections within photonic integrated circuits (PICs) or their package and assembly components to guarantee effective fiber-to-chip or chip-to-chip connectivity.
In-glass photonic wire-bonding.
Monolithic integration of photonics functions.
Free-form fabrication in 3D, including design for manufacturing.
Combination of 3D bends, tapers & mode converters with low-loss glass waveguides.
Precise integration with hole arrays, V-grooves, and micro-optics.
Self-alignment of all elements within +/- 1 µm.
Thermal stability and optimized thermal properties for integrated photonics.
