Fiber connectivity goes 2D and seeks sub-micron alignment precision!
Fiber-connectivity for datacom applications, specifically for the new AI-enabling data centers, is nowadays moving from 1D to 2D fiber arrays, which allow the integration of way more channels per surface unit, thus increasing the level of miniaturization, improving the transmission speed, and reducing the overall energy consumption.
FEMTOprint’s glass micro-manufacturing technology enables the fabrication of high-precision glass ferrules with 1D V-grooves or 2D hole arrays, which can meet the stringent requirements on both precision and tolerance accuracy for fiber-to-chip alignment demanded by our customers in datacom & telecom to comply with the performance standards set for their final products.
With years of experience in the production of glass micro-components in the photonics industry, we support our customers from fast prototyping to wafer-scale volume production, offering:
- 1D V-grooves & 2D hole arrays in fused silica, borofloat (BF33) and ultra-low expansion glass (ULE)
- Thin to thick glass ferrules for optimised mechanical stability (few mm up to cm hundreds of microns to millimeters)
- Standard deviation below 0.5 micron on serial production batches
- Fully customizable 2D hole arrays with tailored hole shape, vertical or tilted holes
- Sub-micron control (down to 0.5 micron) of the hole parameters
- Customized mounting features and fiducials (on the surface or in the bulk)
- Monolithic integration with other components (optical micro-structures & waveguides)
