21st March – Neuchatel (CH)
Get ready to dive into the fascinating world of photonic integration and packaging with our Optics & Photonics expert Rolando Ferrini!
Talk: "From high-precision glass micro-components to monolithically integrated glass micro-systems for fiber-to-chip connectivity“
With the demand for high-performance photonic systems skyrocketing across industries like optical communications, sensing, and quantum computing, novel micro-components for photonic integration and packaging are a hot topic!
Don't miss this opportunity to gain an insightful understanding of the latest advancements and innovations in the field with this workshop organized by the Swiss Photonics Integration Center (Swiss PIC) and CSEM.
Looking forward to meeting you there!
