As data traffic continues its exponential growth, CTOs face an urgent challenge: how to design data centers that can deliver higher bandwidth, lower latency, and greater energy efficiency—without being constrained by the limits of electronics.
This is where FEMTOPRINT comes in. With unique capabilities in glass micro-fabrication, we provide the enabling technologies for the next wave of integrated photonics and co-packaged optics.
On September 5th at EPFL Lausanne, during the Swissphotonics Photonics 4 Data Centers Workshop, our colleague Rolando Ferini will present:
“Glass Micro-components for Fiber Connectivity in Integrated Photonics and Co-Packaged Optics”
Don't miss this event. 3 reasons.
Many players in photonic packaging are still limited to lab prototypes. FEMTOPRINT bridges the gap: we deliver industrial-grade glass micro-components that meet the precision, scalability, and reliability demands of hyperscale data centers.
Our proprietary glass micromachining technology enables alignment-tolerant interfaces for fiber-to-chip coupling. The result: robust, low-loss connections that are critical for high-density co-packaged optics.
In the post-Moore’s Law era, scaling cannot rely solely on transistor density. FEMTOPRINT provides bespoke glass micro-components that integrate seamlessly into next-gen photonic modules, ensuring long-term performance, lower power consumption, and reduced total cost of ownership.
FEMTOPRINT’s Competitive Advantage
This is not just incremental improvement. it’s a paradigm shift in how fiber connectivity and photonic packaging are designed and produced.
Let’s Build the Future of Data Centers Together
